This is an outstanding book. It provides an overview of the current status of CMP and serves as a significant update to Steigerwald's 1997 book, which summarized the state of CMP knowledge (which began for electronic applications in 1991)at that time. Much has happened in the second half of CMP's existence.
The book is well edited by Mike Oliver. It includes chapters written by well known CMP specialists that focus on process aspects (technology, equipment, pads, cleaning), on metals (theory and applications), on slurries, and on patterned wafers. It also provides chapters with overviews of CMP. Each chapter has extensive references.
The individual chapters are carefully written to offer an introduction and broad perspectives to new CMP workers while providing depth of insight and material for experienced practitioners. This is an ideal book for advanced undergraduates and graduate students who are working in the field and for those who are starting to do planarization of semiconductor materials. It is also an ideal reference book for experienced polishers since it gives information about the process at a level that is useful and insightful.
I have found the book very useful to me both for its clear summaries of material that I already know about and for its helpful explanations of areas that I am not familiar with. I highly recommend it.
Read More Reviews on Chemical Mechanical Planarization of Semiconductor Materials...
